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Bond X


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Acid-free bonder which can be used with gel polish, gel and acrylic, it can even be used under traditional nail polish. It penetrates the nail plate cleaning out the ridges of any oils, fats or dirt before filling the ridges with a special kind of gel leaving the surface layer very sticky. It provides maximum adhesion for all products, eliminate lifting to a minimum and will increase the longevity of the wear.

Ingredients: MEK, Urethane Methacrylate, HEMA, Hydroxypropyl Methacrylate, Trimethylbenzoyl Diphenylphosphine Oxide



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Bond X

Bond X

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